Diebond AD210 Plus
TYPE：Semiconductor equipment
TIME：2020-11-20
VIEW：76
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Details
features
High welding position accuracy
Substrate processing capacity up to 8 "x 8"
Independent control of crystal extraction and crystallization process
Patented welding head design
UV Fast curing system (Options)
size
2,150 x 1,400 x 2,300 mm
High welding position accuracy
Substrate processing capacity up to 8 "x 8"
Independent control of crystal extraction and crystallization process
Patented welding head design
UV Fast curing system (Options)
size
2,150 x 1,400 x 2,300 mm